The Open-Standard C-GPU solutions, offered as IP blocks and software, enable leading processor companies to develop low-power SoCs for Next Generation 3D Graphics, Compute, and AI/ML enabled wearables ...
Cray plans to create a new supercomputing platform combining four types of processing capability in a blade server architecture. Cray Inc. plans to create a new supercomputing platform combining four ...
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AMD publishes first Zen 6 document detailing ground-up redesign on 2nm process node — brand-new 8-wide CPU core with strong vector capabilities
AMD's Zen 6-based CPUs may be number crunching monsters, given their core design that is partially revealed in a performance counters document.
Most chips today are built from a combination of customized logic blocks that deliver some special sauce, and off-the-shelf blocks for commonplace technologies such as I/O, memory controllers, etc.
A new technical paper titled “MultiVic: A Time-Predictable RISC-V Multi-Core Processor Optimized for Neural Network Inference” was published by researchers at FZI Research Center for Information ...
Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. Ahead of Computex 2024 this week, Intel gave select members of ...
SAN MATEO, Calif.--(BUSINESS WIRE)--SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced that Dr. Chris Lattner, President of Engineering and ...
Processor vendors are starting to emphasize microarchitectural improvements and data movement over process node scaling, setting the stage for much bigger performance gains in devices that narrowly ...
Page 2: A Closer Look At RDNA 3.5 Graphics, The XDNA 2 AI Engine And Final Thoughts AMD Ryzen AI 3000 (Mobile) And Ryzen 9000 (Desktop) AMD has revealed some new architectural information regarding ...
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