A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...

Kulicke & Soffa Industries Inc. today said Amkor Technology has indicated it will buy 200 of its Maxum ball bonders for ramping to ultra fine pitch wire bond technology. K&S said it expects to begin ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

I recently spoke with Chan Pin CHONG, Executive Vice President and General Manager of Products and Solutions at Kulicke & Soffa, about how smart manufacturing is driving new production efficiencies in ...